Description of cheap potting compound silicone for circuit board
RTV160 is a two-component room temperature cure potting compound with mix ratio of 1: 1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It's suitable for encapsulating of LED displayers, power module and electronics components, etc.
Features of cheap potting compound silicone for circuit board
Easy mix with 1: 1 proportion
Low viscosity, good flow ability
Room temperature cure or heat up cure
Thermal conduction, flame resistance
Without solvent
Using Instructions of cheap potting compound silicone for circuit board
1. Preparing: Clean up the coating surface, remove the rust, dust, oil dirt.
2. Pouring: Weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.
3. Curing: Room temperature cure or heat-up cure is both workable.
4. It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.
Technical datasheetof cheap potting compound silicone for circuit board
Item No. RTV 160
ColorGrey
Viscosity mPa. S 25C3000~6000
Density g/cm31.57± 0.02
Pot life min 25C30
Curing time H24
Curing time with heat min 100C10
Hardness shore A55~60
Dielectric strength kv/mm 25C≥ 20
Volume resistivity DC500V Ω Cm3× 1015
Tensile strength Mpa≥ 0.6
Thermal conductivity w/m0.58
Temperature C-30~200
Note: Mechanical and electrical performance data tested at 25° C 7 days after curing, relative humidity of 55%; All the tested data is average value.
Packaging of cheap potting compound silicone for circuit board
Packs are available in 20kg and 200kg per drum.
Storage & Transportation of cheap potting compound silicone for circuit board
1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods.
| Item No. |
RTV 160 |
| Color |
dark gray |
| Mix Ratio |
1:1 |
| Viscosity mPa.s 25C |
< 4000 |
| Density g/cm3 |
1.57±0.02 |
| Pot life min 25C |
30 |
| Curing time H |
24 |
| Curing time with heat min 100C |
10 |
| Hardness shore A |
55-60 |
| Dielectric strength kv/mm 25C |
≥20 |
| Volume resistivity DC500v Ω?cm |
3×10 15 |
| Tensile strength Mpa |
≥0.6 |
| Thermal conductivity w/m |
0.63 |
| Temperature C |
-30-200 |
){kind=link}
){kind=link}