Description of Two-Part Potting/Encapsulating Compound Silicone:
Two-Part Potting/Encapsulating Compound Silicone is a room temperature cure potting compound with mix ratio of 1: 1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It's suitable for encapsulating of LED displayers, power module and electronics components, etc.
Features of Two-Part Potting/Encapsulating Compound Silicone:
Easy mix with 1: 1 proportion
Low viscosity, good flow ability
Room temperature cure or heat up cure
Thermal conduction, flame resistance
Without solvent
Using Instructions of Two-Part Potting/Encapsulating Compound Silicone:
1. Preparing: Clean up the coating surface, remove the rust, dust, oil dirt.
2. Pouring: Weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.
3. Curing: Room temperature cure or heat-up cure is both workable.
4. It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.
Packaging of Two-Part Potting/Encapsulating Compound Silicone:
20kg and 200kg per drum.
Storage & Two-Part Potting/Encapsulating Compound Silicone:
1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods.
| Item No. |
MCSIL-E160 |
| Color |
gray |
| Mix Ratio |
1:1 |
| Viscosity mPa.s 25C |
< 4000 |
| Density g/cm3 |
1.57±0.02 |
| Pot life min 25C |
30 |
| Curing time H |
24 |
| Curing time with heat min 100C |
10 |
| Hardness shore A |
55-60 |
| Dielectric strength kv/mm 25C |
≥20 |
| Volume resistivity DC500v Ω•cm |
3×10 15 |
| Tensile strength Mpa |
≥0.6 |
| Thermal conductivity w/m |
0.63 |
| Temperature C |
-30-200 |
){kind=link}