• Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
  • Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
  • Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
  • Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
  • Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
  • Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting

Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting

Raw Material: Silicone Rubber Raw Material
Material: Silicone Rubber
Appearance: Liquid
Form: Liquid Rubber
Item: RTV 160
Color: Grey
Samples:
US$ 1/kg 1 kg(Min.Order)
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Basic Info.

Model NO.
RTV160 Silicone Rubber
Mixing Ratio
1:1
Mixed Viscosity
3000-6000 Cps
Working Time
30 Mins
Curing Time
24 Hours
Hardness
56 Shore a
Dielectric Strength
20
Volume Resistivity
3×1015
Thermal Conductivity
0.62
Transport Package
20kg/Drum, 25kg/Drum or 200kg/Drum
Specification
REACH
Trademark
MC SILICONE
Origin
China
HS Code
39100000
Production Capacity
4000kg/Day

Product Description

Description of Silicone Rubber For Electronic Encapsulating&Potting

RTV160 is a two-component room temperature cure potting compound with mix ratio of 1: 1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It's suitable for encapsulating of LED displayers, power module and electronics components, etc.
Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
Features of Silicone Rubber For Electronic Encapsulating&Potting

Easy mix with 1: 1 proportion
Low viscosity, good flow ability
Room temperature cure or heat up cure
Thermal conduction, flame resistance
Without solvent
Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
Technical datasheetof Silicone Rubber For Electronic Encapsulating&Potting
Item No. RTV 160
ColorGrey
Viscosity mPa. S 25C3000~6000
Density g/cm31.57± 0.02
Pot life min 25C30
Curing time H24
Curing time with heat min 100C10
Hardness shore A55~60
Dielectric strength kv/mm 25C≥ 20
Volume resistivity DC500V Ω Cm3× 1015
Tensile strength Mpa≥ 0.6
Thermal conductivity w/m0.62
Temperature C-30~200

Note: Mechanical and electrical performance data tested at 25° C 7 days after curing, relative humidity of 55%; All the tested data is average value.

Using Instructions of Silicone Rubber For Electronic Encapsulating&Potting

1. Preparing: Clean up the coating surface, remove the rust, dust, oil dirt.

2. Pouring: Weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.

3. Curing: Room temperature cure or heat-up cure is both workable.

4. It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.

Packaging of Silicone Rubber For Electronic Encapsulating&Potting

Packs are available in 20kg and 200kg per drum.
Two-Component RTV Silicone Encapsulant for Electornics Power Module Potting
Storage & Transportation of Silicone Rubber For Electronic Encapsulating&Potting

1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods
Item No. RTV160
Before curing
Appearance A:grey  B: white
Viscosity (mPa.s 25C) 3000~6000
Density  (g/cm 3  1.57±0.02
Working life  (min 25C) 30
Curing time  (hrs) 24
Heat-up at 100C  (min) 10
After curing
Hardness  (shore A) 56
Dielectric breakdown voltage kv/mm 25C ≥20
Volume resistivity   ohm*cm 3*10 15
Tensile Strength  Mpa ≥0.6
Thermal conductivity   w/m 0.62
Working temperature  C -30~200


If you have any question, please do not hesitate to contact Julie for more details, thank you.

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